Hi,Foil on foam might be better than no solution at all. It was used in the very early days of CMOS IC's and it sort of works. The problem with the foil is that it is conductive rather than dissipative. The difference being that dissipative materials like antistatic bags and foam gently leach away the charge while with conductive metal foil the charge is zapped away. Zaps are not good for CMOS.
On the other hand, being a hobbyist making one or a few of something is different from running a factory in which you will make hundreds of thousands of something each day are very different. If a hobbyist has an ESD problem it cost a few dollars and a few days, but if a manufacturer starts getting returns from the field of only a small percentage of units, that is a real problem.
That is an interesting observation, anti static vs conductive foil.
One of the other problems i noticed with foil is that once the IC pin hole forms, it might enlarge with some movement and thus not make contact anymore. That always bugged me.
I keep the IC's in the original packaging until ready to use, but then again i get most of my stuff from places that know how to ship properly.
One time i got a somewhat expensive PC board with NO anti static packaging whatsoever. I freaked out when the board didnt work, and emailed the seller and pretty much told them off pretty good. Later i found out the reason it did not work was because the wire lengths i was using were too long for the frequency. My bad, but i did not let them slide on it anyway and told them they better learn how to ship properly. If it was shipped properly i would have never freaked and would have looked into it more carefully before emailing them.
So word to the wise, use sellers that know how to ship to begin with and use the packaging they provide which is usually good.
I have parts from the mid 1970's and they still work, and even a few (not many though) earlier than that. I keep my stuff stored as safely as possible.