Here's a picture of a TO-3 I took apart when I was an R&D tech and was curious about what things look like when I was learning CAD:

Teardowns I've seen for newer devices all used bond wires to connect to the die. This device was from the 1970's.
The solder blob on the upper connection was a misguided attempt by me to reattach the lead that came loose.

Teardowns I've seen for newer devices all used bond wires to connect to the die. This device was from the 1970's.
The solder blob on the upper connection was a misguided attempt by me to reattach the lead that came loose.