ICs are fabricated by a series of deposition of layers of material and etching. Bonding wires are only used to connect the die to the IC pins.
http://www.circuitstoday.com/nmos-ic-fabrication-process
http://www.chm.bris.ac.uk/~paulmay/misc/msc/msc1.htm
http://www.circuitstoday.com/nmos-ic-fabrication-process
http://www.chm.bris.ac.uk/~paulmay/misc/msc/msc1.htm