Hey everybody, I'm working on redesigning an existing board layout to accommodate different connectors, and it's made the layout pretty cozy. I've got two 1206 resistors whose pads are basically touching, and I'm wondering if that's a problem.
They're part of the same node, and connected by traces anyway, so I'm not worried about electrical connections. All I'm wondering is if having the pads essentially merge into one has any risks in terms of manufacturing processes. Will the solder paste on the two pads make a different shape? Does molten solder have a surface tension that will make it pull towards the center of the combined mega-pad (and away from the components?) Are the connections more likely to fail when their pads don't have the usual well-defined borders with soldermask in between?
This will be mass produced, with pick and place machines, reflow ovens, etc. so I'm not worried about hand-soldering (although repair/rework may be more difficult with tight spacings and thermal coupling.)
They're part of the same node, and connected by traces anyway, so I'm not worried about electrical connections. All I'm wondering is if having the pads essentially merge into one has any risks in terms of manufacturing processes. Will the solder paste on the two pads make a different shape? Does molten solder have a surface tension that will make it pull towards the center of the combined mega-pad (and away from the components?) Are the connections more likely to fail when their pads don't have the usual well-defined borders with soldermask in between?
This will be mass produced, with pick and place machines, reflow ovens, etc. so I'm not worried about hand-soldering (although repair/rework may be more difficult with tight spacings and thermal coupling.)
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