I have D2Pak -power diode on PCB, and it will need some heat management due to the high pass current. I don't want to reserve a too large copper area from the Cathode side to spread the heat to the PCB but to use a heat sink. Two methods are available but which one is better. 1)Component is soldered to the PCB and directly on top of the component is a glued heat sink. 2) Reserve a copper area just next to the component and glue the same size heat sink to the PCB.
Which way is better for heat management?
Sure I can evaluate this but what is your opinion ? depends offcourse on many factors like the area, but lets say the heat sink is the same on both cases.
There is also improved component cases than D2PAK for this, like Vishay V20DL45 with TO-263AC which have thinner case to have shorter distance from the substrate to the surface..
-J
Which way is better for heat management?
Sure I can evaluate this but what is your opinion ? depends offcourse on many factors like the area, but lets say the heat sink is the same on both cases.
There is also improved component cases than D2PAK for this, like Vishay V20DL45 with TO-263AC which have thinner case to have shorter distance from the substrate to the surface..
-J