No. If you're reflowing (remelting) solder,So would it be effective to move the iron away the same moment that you apply the solder?
- you melt the solder thoroughly
- insert the wire, let it get hot enough to form an alloy between the wire, solder, lead, and pad
- remove the iron
- let the solder cool without jostling it
Solder joints with lead solder will be shiny. If you use 63/37, you're less likely to have cold joints. Lead free solder will give dull joints.
If you were soldering a new joint, you
- use the iron to heat the pad and lead/wire simultaneously
- apply solder to the pad/lead opposite from where the iron is positioned
- when enough solder has melted to form a good joint, move the solder wire away from the joint
- remove the iron
- let the solder cool without jostling it
Solder applied to the tip and/or flux applied to the joint can be used to facilitate heat transfer.
EDIT: All of these joints are bad. The burned insulation on the wires is indicative of a misplaced tip or too much heat...
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