Hello all,
I did a board with a 1mm pitch BGA 676-pins. The problem is that the fanout connections to vias are completely unshielded via soldermask, since they're so small.
I have a solder stencil, which I had planned on using to apply a small amount of paste to each pad. Then, I plan on using a hot plate to flow the board.
Must I use paste on the BGA pads? I know that the BGA balls are composed of solder, can I not just use no-clean flux and count on the solder from the balls to make the connection? My fear is that I will apply too much paste via the stencil, then short out the connections between pads and vias between them.
Anyone have experience with this?
Steve
I did a board with a 1mm pitch BGA 676-pins. The problem is that the fanout connections to vias are completely unshielded via soldermask, since they're so small.
I have a solder stencil, which I had planned on using to apply a small amount of paste to each pad. Then, I plan on using a hot plate to flow the board.
Must I use paste on the BGA pads? I know that the BGA balls are composed of solder, can I not just use no-clean flux and count on the solder from the balls to make the connection? My fear is that I will apply too much paste via the stencil, then short out the connections between pads and vias between them.
Anyone have experience with this?
Steve