Hi,
I'm trying to understand eletrical dynamics in pcb boards.
In a mix of power and ground planes, the return currents always flow in the closest plane and have to go through many bypass capacitors. (High Speed Digital Design - Prentice Hall - Johnson- Graham).
I have a board with different power planes (1.5V, 3.3V and 2.5V). In case an internal trace layer is between a 3.3V power plane and a ground plane, which plane uses the return current of a trace betwwen 2 components powered by 1.5V? Near the components there are only 1.5V bypass capacitors.
3.3V bypass capacitors are away from the trace. The distance between the signal layer and the 3.3V plane is less than the distance from signal trace to GND.
Thanks for the support.
Bryan
I'm trying to understand eletrical dynamics in pcb boards.
In a mix of power and ground planes, the return currents always flow in the closest plane and have to go through many bypass capacitors. (High Speed Digital Design - Prentice Hall - Johnson- Graham).
I have a board with different power planes (1.5V, 3.3V and 2.5V). In case an internal trace layer is between a 3.3V power plane and a ground plane, which plane uses the return current of a trace betwwen 2 components powered by 1.5V? Near the components there are only 1.5V bypass capacitors.
3.3V bypass capacitors are away from the trace. The distance between the signal layer and the 3.3V plane is less than the distance from signal trace to GND.
Thanks for the support.
Bryan