Hi,
I have a doubt friends, I sent some pcbs to manucfacture.
My desing was originally 2 layers, but I took a 8 layers deal for the same price and ENIG for free, so I made another 6 inner layers for ground/heatsink as soon as possible to take the deal.
But my concern is about the bottom layer (#8) and the layer #7, this pcb is for a flashlight so the layer #8 has a pad in the center for a Li-ion battery positive side and the layer #7 in the center has ground.
Do you think the prepeg between layer #8 and #7 is strong enough to prevent a Li-ion cell from a short circuit under stress?
With stress I mean, the battery is really thight inside the flashlight because it is hold by springs, and I'm worrying about the copper in the layer #8 could make contact with the layer #7 due to the pressure applied in the Vcc pad with the battery.
I have a doubt friends, I sent some pcbs to manucfacture.
My desing was originally 2 layers, but I took a 8 layers deal for the same price and ENIG for free, so I made another 6 inner layers for ground/heatsink as soon as possible to take the deal.
But my concern is about the bottom layer (#8) and the layer #7, this pcb is for a flashlight so the layer #8 has a pad in the center for a Li-ion battery positive side and the layer #7 in the center has ground.
Do you think the prepeg between layer #8 and #7 is strong enough to prevent a Li-ion cell from a short circuit under stress?
With stress I mean, the battery is really thight inside the flashlight because it is hold by springs, and I'm worrying about the copper in the layer #8 could make contact with the layer #7 due to the pressure applied in the Vcc pad with the battery.
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