Hello,
I want to use PCB copper coverage area to dissipate heat as recommended for TinySwitch-III PMIC, but in the datasheet they didn't specify the area beneath the IC (PDIP-8C Package).. So how can i determine the exact area of copper for better heat dissipation? same for L78M (DPAK)?!
Please if there are any other tips or tricks regarding the matter, please do tell !

Regards,
I want to use PCB copper coverage area to dissipate heat as recommended for TinySwitch-III PMIC, but in the datasheet they didn't specify the area beneath the IC (PDIP-8C Package).. So how can i determine the exact area of copper for better heat dissipation? same for L78M (DPAK)?!
Please if there are any other tips or tricks regarding the matter, please do tell !

Regards,