Brainstorming Connection types for IoT Solar Module

Thread Starter

Learn2Learn42

Joined Mar 14, 2024
3
Hello everyone,

I am working to solve an a connection type issue for a customer of ours. I work for a small family owned/operated business that produces OEM and custom small application solar modules. We have a customer who has an IoT application using a small solar panel to act as a Voltage Indicator.

Here is a rundown of the situation for context:

Previously, version 1 was hand built using FR4 board with straight wire wrap terminal pins hand inserted and bent. Then solar cells were shingled and taped to the FR4 substrate and tabbing wire routed to complete the circuit; connections then potted with 2 part epoxy. After that, mounting tape was added around the edges and a PET lens is applied.

r/ElectricalEngineering - Brainstorming! IoT Solar Module connection type
V1 Front & Back View





r/ElectricalEngineering - Brainstorming! IoT Solar Module connection type
View of Pins bent, installed, and solder capped to prevent push-through



r/ElectricalEngineering - Brainstorming! IoT Solar Module connection type
View of layers and pins cut to length for install to PCB assembly board

Not cost effective and profit margin factoring in re-work, etc., was non-existent, practically at a loss. Quality of seal not up to standards and so on. In April of last year I sent samples of panels with performance figures similar to the previous version that was outsourced that used more cost effective methods of SMT and used PET lamination techniques. We have used this combination of methods with other custom panels, except this application uses a pin as it's connection type rather than wires added to the back contacts.

They had samples from April 2023, sat on them and neglected to do their due diligence, came time for them to submit a PO for 3,500 of them, quickly tested performance and gave the green light for production. After a couple weeks they come back asking us to stop production as they feel there is excessive solder at the base of the pin on the back of the panel. For them, this does complicate the vertical clearance of the panel at the pins causing the panel to be mounted at a slight angle rather than parallel to the assembly board.



r/ElectricalEngineering - Brainstorming! IoT Solar Module connection type
Version 2 view of layers and solder at base of pin

The PCB substrate in V2 is considered one sided, pathway on the back of the panel, Non-plated Through Hole.

One way to approach it is to move pathway to solar facing side and/or make it a Plated Through Hole. This requires additional steps in terms of installing the pins and thus raises cost. Additionally, I believe it will further complicate how well the PET lamination layer adheres to the substrate. In the picture below, you can see where the lamination is warped around the pins. On a number of the panels we are seeing delamination around this area due to the lamination adhesives having less purchase on the substrate.



r/ElectricalEngineering - Brainstorming! IoT Solar Module connection type
V2 Warping of PET around pin area leading to delamination



r/ElectricalEngineering - Brainstorming! IoT Solar Module connection type
Final assembly board (White Rectangle is the mounting area for our panel)

  • The pins are currently 0.025" square posts for 0.042" through holes


r/ElectricalEngineering - Brainstorming! IoT Solar Module connection type
Final assembly encased (Clear encasement is why vertical clearance is a concern)



I am looking for an alternative way to connect this panel to the assembly board.

As I see it there are a couple different ways to go about it.

- Plated Through Hole or double sided board, using same pin.

BUT... Delamination will still be a concern and can compromise quality. Pins are also likely to be discontinued in the future, as alluded to by the manufacturer....

- Create a stand off area for the contacts/terminals that is not laminated. This stand off area can utilize the typical contact type used in solar modules of this type seen in the picture, or can be a Through Hole of some type using a pin or other terminal type. (See EXAMPLE)



r/ElectricalEngineering - Brainstorming! IoT Solar Module connection type
EXAMPLE Stand Off area w/ typical contact pads



BUT... The manufacturer I have outsourced to is not capable of doing a standoff area without lamination because the lamination has to be manually removed. OR, our customer doesn't want to adjust contact type/processing of their current assembly board.

My question to all of you is... What types of connections or otherwise alternative designs can you think of that are applicable? Do you know of any terminals that can do the job? Any other suggestions of how to approach the problems?

I have been searching and searching for a solution that solves multiple problems at once. I have a few candidates, but I want to reach out to the community and ask for some help brainstorming.... I have come across a variety of pins like the one below in a few different morphologies. I am concerned with cost and if material, like brass, of the pins would make it difficult to clip to size.



r/ElectricalEngineering - Brainstorming! IoT Solar Module connection type
EXAMPLE Alternative pin candidate



Any and all help would be greatly appreciated! Thank you!
 

Ya’akov

Joined Jan 27, 2019
10,235
Welcome to AAC.

It’s a little hard to wade through all the detail of your post but have I got it right that you need an alternative pin that is lower profile but still must connect to the pads on the top side of your board?
 

Thread Starter

Learn2Learn42

Joined Mar 14, 2024
3
Thank you for the welcome!

In a nutshell, yes, I am looking for an alternative pin type connection with a lower profile that does not interfere as much with the encapsulation layer.

Alternatively, I am also looking for connection types that overall has a low profile and could circumvent the need for a pin connection.
 

MisterBill2

Joined Jan 23, 2018
27,522
There are companies that specialize in cold-headed parts and I am certain that one of them can produce the.025" square pins with a thin cold head suitable for contact on the one end. And just because one company would not produce those pins does not mean that there are not others very happy to sell you as many million as you can pay for. But to retain the pins you will need smaller holes (0.035) so they can be a machine press fit. If you used solder tinned plated thru holes that might be adequate and no solder needed. Conductive epoxy, possibly metal particle filled, could attach the photocells.
 
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