Hi everyone,
So I have started my newest production line (the through hole plate system), but I am having some trouble with the electroplating method. Well, the boards DO plate (and very nicely), but I wish to continue to improve the quality.
So, from what I know.
The acid helps with conduction (like sulphuric acid)
Copper sulphate keeps copper ions in the electrolyte
PEG (is my leveller), stops spikes from forming
But there are other things which I dont understand what their true purpose is and what chemical I could use:
Brighter ?
Additives ?
Carrier ?
Any suggestions or experience from others?
All the best,
Robin
BTW: Some of the plating:
So I have started my newest production line (the through hole plate system), but I am having some trouble with the electroplating method. Well, the boards DO plate (and very nicely), but I wish to continue to improve the quality.
So, from what I know.
The acid helps with conduction (like sulphuric acid)
Copper sulphate keeps copper ions in the electrolyte
PEG (is my leveller), stops spikes from forming
But there are other things which I dont understand what their true purpose is and what chemical I could use:
Brighter ?
Additives ?
Carrier ?
Any suggestions or experience from others?
All the best,
Robin
BTW: Some of the plating:
Last edited: