Ok, So I'm calculating what size heat sink I will need. I got the formula here.
Where
Tj = Maximum semiconductor junction temperature
θjc = Thermal resistance, junction to case.
Tc = Case temperature
θcs = Thermal resistance, case to heatsink (see Hot Tips)
Ts = Heatsink temperature
θsa = Thermal resistance, heatsink to ambient.
Ta = Ambient temperature
values:
Tj = 120C
Ta = 50C
Q = 216W
θjc = .402
θcs = .25 (conservative estimate, based on seeing 1C/W when no thermal paste used, and seeing .09 when good thermal paste used)
I get
-0.328C/W
Does that mean I did something wrong, or that I need to pump liquid nitrogen through my heat sink (or would water suffice?), or that what I want is impossible?
Where
Tj = Maximum semiconductor junction temperature
θjc = Thermal resistance, junction to case.
Tc = Case temperature
θcs = Thermal resistance, case to heatsink (see Hot Tips)
Ts = Heatsink temperature
θsa = Thermal resistance, heatsink to ambient.
Ta = Ambient temperature
values:
Tj = 120C
Ta = 50C
Q = 216W
θjc = .402
θcs = .25 (conservative estimate, based on seeing 1C/W when no thermal paste used, and seeing .09 when good thermal paste used)
I get
-0.328C/W
Does that mean I did something wrong, or that I need to pump liquid nitrogen through my heat sink (or would water suffice?), or that what I want is impossible?
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