Thermal Aware methodology for Repeater insertion in Low power VLSI circuits

I am doing my ME in Embedded and Real time System.I chose one paper (IEEE transaction on VLSI .vol.15,No.8,August 2007 ) as the base of my ME main project. Now i have some doubts in that SPICE simulation that used in this paper. I want to know whether i can Implement this project or not?In that paper they r using Spice simulation 4 comparison purpose. So i want 2 know which circuit we want 2 use 4 that? Hopping that u can help me by sugesting some ideas.