Discussion in 'Embedded Systems and Microcontrollers' started by TU_88, Jul 27, 2010.

  1. TU_88

    Thread Starter New Member

    Jul 27, 2010

    I currently try to get known to different IC packaging opportunities.

    For example I'm interested in System-in-package design. (FlipChip or Wirebonding)
    For example I want to buy the 'dies' (without bonding & packaging) directly from the Fab (e.g. TI) and then connect these dies in a special way. (->SiP)

    Which software is necessary or recommended to design such SiPs?

    Has anyone experience with designing SiPs? Is it possible to pack Chips from different companies (layout and design is unknown) into one package, as mentioned before?

    Would be thankful for every kind of help.

    Best regards.