Greetings! My name is Adam. This is my first post. =)
Hopefully someone out there can give me a hand.
I have been attempting to design a board for the STM32F4 in 4-layers which I plan to order from OSHPark.com. Why 4-layers? My goal is to see if I can get the UFBGA-176 chip booted. That's it! There is no other goal other than assembling the board with the BGA chip and blinking an LED with it.
In some examples I have found online there is a capacitor between the VDD (3.3v) and GND on each VDD output on the chip. Most of the VSS (GND) pins on the chip are a cluster of 25 pins in the middle and a few others scattered around.
Is it necessary to connect every VSS and VDD pin (ball) to boot?
Are the capacitors necessary to boot?
You guys rock!
-Adam
Hopefully someone out there can give me a hand.
I have been attempting to design a board for the STM32F4 in 4-layers which I plan to order from OSHPark.com. Why 4-layers? My goal is to see if I can get the UFBGA-176 chip booted. That's it! There is no other goal other than assembling the board with the BGA chip and blinking an LED with it.
In some examples I have found online there is a capacitor between the VDD (3.3v) and GND on each VDD output on the chip. Most of the VSS (GND) pins on the chip are a cluster of 25 pins in the middle and a few others scattered around.
Is it necessary to connect every VSS and VDD pin (ball) to boot?
Are the capacitors necessary to boot?
You guys rock!
-Adam