No, there is a difference.A thermal pad or via is a pad or via connected using radial spokes to a large copper plane. This is so that it is easier or solder and unsolder.
IPC-2221 covers thermal reliefs.Unless someone can point to a standards document or some kind of reasonably definitive and authoratative source, people may have to agree to disagree on what a "thermal via" is.
For my $0.02 worth, I have generally seen the terminology that a typical pad has "thermal reliefs", while a "thermal pad" does not.
Because its a via with the intended purpose to allow a better transfer of heat between the layers. A regular vias purpose is not that at all but the shape is identical. Thermal vias can make a HUGE difference.I have no problem with a "thermal relief".
But why a special name for a "thermal via" if all it does is connect to another plane?
no difference in the fabrication process.. But its "function" is different..How is a thermal via constructed that makes it different from a regular via?
Just asking because I don't know.
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