The junction-to-case thermal resistance is not helpful for the device in free air and not on a heat sink. You need the junction-to-ambient thermal resistance as shown in the reference I posted.For a simple transistor example the 2N3055 might be of interest. Data sheet attached - page 2 particularly important with respect to your question.
I recall the package thermal resistance is ballpark 45C/W. In 25C ambient, you can dissipate about 2.5W safely without heatsink. But that puts the junction temp at about 150C where most IC's go into thermal shutdown.How much power can a TO-3 transistor package dissipate w/o a heat sink?
Can anyone give me a reference also?
I just don't know where to look.....Tried searching but no results....
Thanks in advance!
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