Huh?. many solders are tin.. Up until a few years ago (prior to ROHS) most places were using 63/37 solder (tin/lead).. Now ROHS has more or less banned lead but straight tin has other issues (tin whiskers) so other methods are now being used like immersion silver/OSP/ENIG.The Tin HASL sounds interesting though so I could just dunk a pcb in a pot of melted tin and blow it off with an air knife or is the pure tin melting point too high? I know the solder and tin melting points are very close. I would like more control of my tin layer though...
How do you electroplate a board that has mostly electrically isolated tracks?Sorry should have clarified.. HASL and immersion tin are obviously not but NI/Gold/Tin are all electroplated onto a PCB as a final finish.. There are also electroless NI/Gold (ENIG) as well as using immersion silver now with ROHS/tight pitch components.
basically there are both electro and electroless processes that are commonly used depending on your needs.
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