MOD NOTE:
The following is the essence of the first post of a thread that was deleted for unrelated reasons but that sparked what many might find a useful conversation. The original replies have been moved to this thread.
The following is the essence of the first post of a thread that was deleted for unrelated reasons but that sparked what many might find a useful conversation. The original replies have been moved to this thread.
I want to have some additional space on PCB for more features. Do I really need 10uF tantalum capacitor near every chip?
Here is my current setup:
- 12V from car,
- AMS1117-3.3 with 330nF ceramic, 10uF tantalum at the input and 100nF ceramic and 10uF tantalum at the output,
- STM32L432 with capacitors according to the datasheet,
- 10uH bead for the analog power supply that powers:
- AD8237 with 100nF ceramic and 10uF tantalum,
- LM324 with 100nF ceramic and 10uF tantalum,
- MCP4725 with 100 nf ceramic and 10uF tantalum,
- ADS1015 with 100nF ceramic and 10uF tantalum.
I am not sure whether to remove the last four ones.
Besides, I would like to change MCU into ESP32-C3, adding wireless capabilities, so that it will introduce additional noise.
MOD NOTE: Below is dl324's response to the original post.
No. A conservative design guideline is to place a 0.1uF ceramic capacitor on each power pin and to distribute electrolytic capacitors based on how the power grid is designed. Sufficiently high frequency designs would add in some 0.01uF ceramic caps.Do I really need 10uF tantalum capacitor near every chip?
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