Hi all,
I'm designing a RF PCB and I was looking at some PCB design guide and a recommendation I found was to place a large number of vias (to the ground plane) under any integrated circuits as they provide good RF grounds and thermal conductivity. I was just wondering why having a large number of vias under an integrated circuit provides good thermal conductivity.
I guess as the temperature rises you have more atoms colliding with each other and knocking electrons off their constituent atoms. The vias would provide an easy path for these electrons. But I'm not sure how that keeps the atoms from knocking the sides of the chip and heating it up. Any ideas?
Not sure if this would be better suited in the physics section. Thanks for reading!
I'm designing a RF PCB and I was looking at some PCB design guide and a recommendation I found was to place a large number of vias (to the ground plane) under any integrated circuits as they provide good RF grounds and thermal conductivity. I was just wondering why having a large number of vias under an integrated circuit provides good thermal conductivity.
I guess as the temperature rises you have more atoms colliding with each other and knocking electrons off their constituent atoms. The vias would provide an easy path for these electrons. But I'm not sure how that keeps the atoms from knocking the sides of the chip and heating it up. Any ideas?
Not sure if this would be better suited in the physics section. Thanks for reading!