I have made myself a reflow oven using an electric frying pan which works really well. I am trying now to improve the quality of my boards.
I have been spreading solder paste as evenly as possible across the board and then placing the components onto the pads into the electric frying pan and it works, however there is not an even flow across all the copper of the solder.
Do surface mount capacitors have tinned leads? Why I am asking Is, I want to find out if flux was used and the components then placed directly onto the pads and into the reflow pan, would the components if factory tinned adhere to the copper pads.
Thanks
Rodney
I have been spreading solder paste as evenly as possible across the board and then placing the components onto the pads into the electric frying pan and it works, however there is not an even flow across all the copper of the solder.
Do surface mount capacitors have tinned leads? Why I am asking Is, I want to find out if flux was used and the components then placed directly onto the pads and into the reflow pan, would the components if factory tinned adhere to the copper pads.
Thanks
Rodney