Hello everyone. I've had a couple of boards made that have .5mm pitch QFNs, and I noticed that some boards have the solder mask over the pads, although some have the solder mask pretty well aligned. I am attaching some images so that you can see for yourself.
Anyway My question is, is it better to increase the soldermask expansion on these chips so that there is no mask between the pads or to risk having mask over the pads? Currently I am using a mask expansion of 1mil.
Anyway My question is, is it better to increase the soldermask expansion on these chips so that there is no mask between the pads or to risk having mask over the pads? Currently I am using a mask expansion of 1mil.
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