1. I am working on application in which there are CHG & DSG mosfet in circuit. I can connect any no of mosfet for CHG or dsg.
CHG & DSG fets are in series so equal current flows through them.
2. In my circuit I have to design it for 10A application. VGs for both CHG & DSG fets are guranted to be 10V always. selected FDS6690A mosfet for this. Will use 3 parallel mosfets for CHG & 3 for DSG.
3. This webiste: http://www.4pcb.com/trace-width-calculator.html
gives idea for PCB trace width for current specified.
4. Now looking at datasheet of mosfet, how much trace/pad length I should use for 10A so that temperature rise should not be more than 20C & ambient temp is 25C?

 

Using the ElectroDroid app, it indicates the trace should be 4.724mm (186 mil) track resistance would be 5.542m Ohm, Voltage drop 55.421mV.

Hope that helps.

 

I use saturn pcb toolkit for all these calculations. https://www.saturnpcb.com/pcb_toolkit.htm

 

https://www.saturnpcb.com/pcb_toolkit.htm under "Thermal Tab". gives option on how much heat sink temperature will go for mosfet IC.

Is there any software which can explain how much track width should be for any mosfet around its drain & source for particular temperature rise.

E.g http://www.4pcb.com/trace-width-calculator.html , mention on how much allowabke temperature rise, current , what should be the track size.