I was hoping the good people at this forum would be able to answer a question about this chip that most new motherboards have on board. The chip is Flip Chip/BGA with FR4 exterior except for the area that the die sits.

If the die is the small shiny area and is essentially the micro controller then what is the content of the outer area ? Would it be the bond wires ? Thanks in advance.

 

usually the outer PCB is just so the connectors on the bottom side can have somewhere to be mounted so it can mate with the socket it plugs into/ solders onto.

 

usually the outer PCB is just so the connectors on the bottom side can have somewhere to be mounted so it can mate with the socket it plugs into/ solders onto.

Thanks for the reply. Very helpful indeed.

Would anyone know where I can find helpful information on how to go about decapping this chip ? I know there are companies that do this sort of thing but I'd like to tackle this on my own. I understand the die is upside down so how would I flip right side up once decapped ?