I've checked some threads here and various other sources regarding IC power supply bypass capacitors, but haven't found what I'm looking for.
I understand the use of bypass capacitors, but can I get away with not putting them on every IC if I plan the layout well? The project I'm working on will have 16 analog IC's running on dual supplies, and if I go with the common 1 high-value & 1-low value bypass cap on each supply pin, that's a lot of capacitors. And that's not counting the other IC's I'll have.
I plan to lay the circuit out such that the analog IC's will be sort of grouped together in clumps of 3-6. Do you think if I put them close enough, I could use one set of bypass caps for each group? They'll be SOIC packages, so they won't cover as much real estate as DIPs.
Also, how hard is it to hand solder tiny surface mount chips? I looked at some MLCC packages and they were less than 1mm per side. I'd go with something through-hole, but from what I read, digital IC's are best bypassed with surface mount chips for lowest inductance.
I understand the use of bypass capacitors, but can I get away with not putting them on every IC if I plan the layout well? The project I'm working on will have 16 analog IC's running on dual supplies, and if I go with the common 1 high-value & 1-low value bypass cap on each supply pin, that's a lot of capacitors. And that's not counting the other IC's I'll have.
I plan to lay the circuit out such that the analog IC's will be sort of grouped together in clumps of 3-6. Do you think if I put them close enough, I could use one set of bypass caps for each group? They'll be SOIC packages, so they won't cover as much real estate as DIPs.
Also, how hard is it to hand solder tiny surface mount chips? I looked at some MLCC packages and they were less than 1mm per side. I'd go with something through-hole, but from what I read, digital IC's are best bypassed with surface mount chips for lowest inductance.