See the attached pic,

It took me Hrs to solder and desolder, and in the end the IC exploded, literally, with a "POP" , and landed else where, not my face, thank god.

I was thinking about it and I came with a small hot plate idea since the TCON board is a single sided surface mount pcb.

My hot plate will be around an inch each side. I can heat it up to 260°C with a temperature controller. It would make a whole easier to pick up and place the chip without blowing it up and flipping away the adjacent components, right ?

I like to know how I can go about it. Say should I use nichrome wires
enclosed in cement and glue metal inch square plate . sides can be eclosed in glass.

Or, how about ceramic low value high power resistors bonded a bunch together and encapsulate it with cement or lead. Give it a controlled power to regulate heat at 260°C.

I can just put the little cube under the pcb heat it up. The PCB will be on the plate. Not convection heating.

Or any other ideas from u guys ?

 

How about making the cube from scrap PCB, maybe a cuboid that extends further below the board and put a temperature controlled iron in there. The air should heat to about the same temperature as the tip.
Don't know how good the results would be, but won't take long to try.

 

I would be concerned about localized expansion causing fractures of traces or via points. The high priced commercial units use a pre-heat of the entire board, then higher temp localized heat on the target component.

 

If the chip is a goner. You may cut it loose with a stanly knife. Use solder wick on the pins first

 

How about making the cube from scrap PCB, maybe a cuboid that extends further below the board and put a temperature controlled iron in there. The air should heat to about the same temperature as the tip.
Don't know how good the results would be, but won't take long to try.

My first thought. Down the drain.

I would be concerned about localized expansion causing fractures of traces or via points. The high priced commercial units use a pre-heat of the entire board, then higher temp localized heat on the target component.

Did not get u ?

If the chip is a goner. You may cut it loose with a stanly knife. Use solder wick on the pins first

I use solder wick to clean the solder. As usual, u are confusing me.

 

If the chip is a goner. You may cut it loose with a stanly knife. Use solder wick on the pins first

I don't think this works for these chips.
And I don't just "don't think". I tried it. It is absolutely impossible.

If you don't mind the heat stress, put the PCB in a domestic baking oven.
After some minutes, you can lift off the IC with a screwdriver.

Most components will survive, except plastic parts, and electrolytic caps.

I have used that to remove large 68ec020 chips.
And I have also used it for reflow soldering.

 

I wonder if a small, high temperature TEC would work. Same idea as the nichrome block but better control.

 

the guys over at Sparkfun are using a skillet

 

I wonder if a small, high temperature TEC would work. Same idea as the nichrome block but better control.

I was wondering tht too. Would a tec survive 300°C.?

 

the guys over at Sparkfun are using a skillet

Tht is the idea pretty much.

 

I've seen an iron used (clothes iron) turned upside down, the hotplate can be removed from all the plastic casing.

 

Try a 12v, 21 watt car brake light bulb under the board. If you need more heat, use a headlight bulb (about 55 watts).

Timescope

 

How about one of these for localized heating? http://www.amazon.com/NORPRO-559-Immersion-Warming-Liquids/dp/B000I8VE68 Luthiers use them to heat up inlays for removal, to break down the glue bond.