The main question here, is where does one draw the line salvaging components, with respect to heat degrading their intended function.
In repair of - say - a dehumidifier power pc that water invaded, and blew the 5+ VR -- TO-220 pkg -- off the board.
I have an air nozzle cobbled down to a luerlock fitting for hypodermic needles.
With a heatsink clamped on leads, I use a "melt & blow" technique to liberate components from their original board.
My main soldering tool for this, is 30w with a 3/16 bevel tip, so dwell on any given connection is way under a second, the burst of air to remove the solder helps to cool the whole shebang on the way out
This approach has been successful up to now, simply because I am able to see a product go out the door working, and have a fair-to-middling good idea it will continue to work, so I get to keep my pay.
I keep a number of pc's with all manner of salvageable components for harvest as needed, and a "packrat" collection you could only imagine.
In repair of - say - a dehumidifier power pc that water invaded, and blew the 5+ VR -- TO-220 pkg -- off the board.
I have an air nozzle cobbled down to a luerlock fitting for hypodermic needles.
With a heatsink clamped on leads, I use a "melt & blow" technique to liberate components from their original board.
My main soldering tool for this, is 30w with a 3/16 bevel tip, so dwell on any given connection is way under a second, the burst of air to remove the solder helps to cool the whole shebang on the way out
This approach has been successful up to now, simply because I am able to see a product go out the door working, and have a fair-to-middling good idea it will continue to work, so I get to keep my pay.
I keep a number of pc's with all manner of salvageable components for harvest as needed, and a "packrat" collection you could only imagine.
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