component manufacture

Discussion in 'Homework Help' started by ninjaman, May 17, 2014.

  1. ninjaman

    Thread Starter Member

    May 18, 2013
    306
    1
    hello

    I have to do a report on how components are made. this is the brief

    Assignment Brief:

    The design and manufacture of electronic components has evolved from simple leaded components to integrated circuits and microprocessors, with new packages being released to the market on a monthly basis. With every leap forward in miniaturisation they must be consequences in performance. Research the current and future trends in component designs.


    Method (tasks):

    Research and compile a report to cover the following topics






    • Describe the process of manufacturing standard electronic components , such as capacitors, diodes, transistors and resistors



    • Describe the process of manufacturing Integrated Circuits.



    • Evaluate the applications of leaded and surface mount Packages, including physical characteristics, production requirements, applications, motivators, economics of production and market requirements


    • Describe factors limiting switching speed of modern semiconductors, including smallest obtainable transistor size and minimum photoresist width


    • Describe design changes that can be made to enhance overall switching speed and the effects on other performance characteristics of making these changes, such as effects on chip and wafer sizes.


    • Consider and describe changes which are predicted to appear in the near future (5 years), include the potential impact of these developments



    Assessment Evidence:

    Produce and engineering report containing as a minimum the following sections, (3000 approx. word count for this assignment ) :

    Front Cover ( with title and your name )
    Table of contents
    Introduction
    Main body
    Technical conclusion
    Personal evaluation
    Bibliography (Harvard style)
    Comments:



    Unit No. & Title UNIT 73: PRINCIPLES OF ELECTRONIC PRODUCT MANUFACTURE
    Assignment Title: Design, Manufacture and Testing of electronic components

    Assessment Criteria / Outcomes:
    LO1 Understand the production
    and packaging of solid-state
    electronic devices
    1.1 describe the production of solid-state devices common
    to the electronics industry

    1.2 evaluate the different types of device packaging
    available
    LO2 Understand electronic
    component design
    parameters
    2.1 explain the effects of altering given design rules on
    microelectronic devices

    2.2 explain failure modes and mechanisms for a range of microelectronic devices




    the part im struggling with is finding web sites that explain how components are made. I have searched using the following words, manufacture, how, made, construction, build, process, procedure, electronics, components.
    nothing came back but basic descriptions of how they work.
    does anyone know of web sites that explain how components are made. please
    thanks
    simon
     
  2. Alec_t

    AAC Fanatic!

    Sep 17, 2013
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    1,103
    ninjaman likes this.
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