Hi all,
I am currently trying to create a footprint for this module:
http://media.digikey.com/pdf/Data Sheets/NAVMAN Wireless PDFs/Jupiter SE880 User Guide.pdf
Page 35.
However, I need to create custom shaped pads. My idea is to place very small smd pads, then use polygon to draw out the correct size for each, adding solder mask stop etc.
However, by default it appears the soldermask stop is set to 0.1mm around the copper. Is there a way to alter this?
Furthermore, the datasheet seems to suggest placing soldermask ontop of the pads by 'some amount'. I was planning to draw out the recommended soldermask stop sizes, and then creating copper polygons to the size that looks about right. Should I do this, or attempt something else?
Regards,
Sparky
I am currently trying to create a footprint for this module:
http://media.digikey.com/pdf/Data Sheets/NAVMAN Wireless PDFs/Jupiter SE880 User Guide.pdf
Page 35.
However, I need to create custom shaped pads. My idea is to place very small smd pads, then use polygon to draw out the correct size for each, adding solder mask stop etc.
However, by default it appears the soldermask stop is set to 0.1mm around the copper. Is there a way to alter this?
Furthermore, the datasheet seems to suggest placing soldermask ontop of the pads by 'some amount'. I was planning to draw out the recommended soldermask stop sizes, and then creating copper polygons to the size that looks about right. Should I do this, or attempt something else?
Regards,
Sparky